GSO IEC 62047-16:2021

IEC 62047-16:2015
Gulf Standard   Current Edition · Approved on 01 July 2021

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

GSO IEC 62047-16:2021 Files

English 21 Pages
Current Edition Reference Language

GSO IEC 62047-16:2021 Scope

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

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