GSO IEC 62047-25:2021
IEC 62047-25:2016
Gulf Standard
Current Edition
·
Approved on
01 July 2021
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
GSO IEC 62047-25:2021 Files
English
45 Pages
Current Edition
Reference Language
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GSO IEC 62047-25:2021 Scope
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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