This part of IEC 60748 applies to high quality approval systems for hybrid integrated circuits and film structures. The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave. These tests are for both Class H and Class K quality levels, SAW and film hybrid/multichip/ multichip module microcircuits using substrates such as ceramic and silicon. Class K is applicable to all microcircuits released to product assessment level schedule 11 (e.g. for space applications ñ see IEC 60748-23-1). Class H is applicable to all other microcircuits released to this standard. The following types of microcircuits may be inspected: a) passive thin and thick film networks; b) active thin and thick film circuits; c) multiple circuits, including combinations, stacking or other interconnections of 1 a) and 1 b). Where the deposited film has geometric features larger than 25 µm, the inspection criteria defined in clause 5 apply. In cases where deposited features are smaller than this (e.g. deposited integrated circuits) the inspection requirements of IEC 60747 shall be applied. These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturersí quality control and handling procedures.