GSO IEC 60749-22:2014
IEC 60749-22:2002
Gulf Standard
Current Edition
·
Approved on
25 December 2014
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
GSO IEC 60749-22:2014 Files
English
41 Pages
Current Edition
Reference Language
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GSO IEC 60749-22:2014 Scope
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits).
The object of this part is to measure bond strength or determine compliance with specified bond strength requirements.
NOTE This test is identical to the test method contained in clause 6 of chapter 2 of IEC 60749 (1996), amendment 1, apart from changes to this clause and renumbering
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