GSO IEC 62137-1-4:2013

IEC 62137-1-4:2009
Gulf Standard   Current Edition · Approved on 31 December 2013

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

GSO IEC 62137-1-4:2013 Files

English 25 Pages
Current Edition Reference Language

GSO IEC 62137-1-4:2013 Scope

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

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